Currently, surface mount technology lines are monitored by two key inspection processes. The first, SPI, reviews the printed circuit board after solder paste has been applied and before components are placed. The second, AOI, reviews the PCB assembly after the board has been assembled and reflowed (or soldered). Now technologists are also using AOI pre-reflow to ensure parts are placed correctly before they are soldered into place.

Beyond their job of identifying errors and preventing incorrect boards from continuing along the line, these inspection processes provide the data needed to improve the performance of the entire line. SPI and AOI can both be used to make live line adjustments to improve quality without stopping the line, and to provide data that helps identify the root causes of failures or variances.

For companies to succeed in the development of Industry 4.0--and perhaps even beyond as we drive toward manufacturing autonomy--they will need inspection solutions, and inspection partners, that can combine domain expertise in optical inspection (vision and software) with the ability to connect to larger systems and contribute to process improvement utilizing tools like artificial intelligence.